Stanton Industries, Inc. is dedicated to providing its customers with high performance based materials. We offer a complete range of metals and ceramics for the microelectronic, display technology, magnetic media, optical, glass and hard coating industries.
Product integrity is our primary objective in serving our customers. From the smallest R&D order to full-scale production, all orders are routed though our rigorous quality system. Our commitment to excellence is demonstrated in the quality of the end product we offer. Product satisfaction is what we guarantee with every shipment!
Sputtering Targets
High purity sputtering targets are manufactured in all popular geometries including planar, circular, rectangular, ring, delta, conical and custom configurations. These materials are either vacuum melted, e-beam melted, hot pressed or sintered. 50 pound to 2500 pound pure metal or custom ingots can be vacuum melted. The ingots are double melted to ensure proper alloying. Test samples are extracted from various locations of the ingot to guarantee the purity and homogeneity.
Evaporation Materials
We offer evaporation materials in many different shapes and sizes to best fit your E-gun pocket, coil, boat or hearth liner. The typical geometries include: pellets, rods, starter sources, wires, powders, tablets, slugs, granulars, cones and foils.
Powder Metallurgy
A variety of material compacting techniques are utilized for refractory ceramics including oxides, nitrides, borides, sulfides, selenides, tellurides, carbides and composite materials. These process techniques include vacuum hot pressing and cold press sintering. Targets can be manufactured from 1/8" size pellets to 18" diameters. Finished targets are typically diamond surface ground or machine lapped to final thickness.
Target Bonding
Typically, target bonding is done using an Indium-based alloy, which enables convenient removal of spent targets for backing plate re-use. Certain types of materials require a silver filled epoxy, which is used to adhere the target material to the backing plate In either case, a protective barrier layer is deposited onto the bond side of the material. This process increases adhesion characteristics, thermal properties and prevents solder diffusion.
Machining Fabrication Center
Equipment includes computer numerically controlled lathes, vertical and horizontal mills, saws, Blanchard and surface grinding capability.
Quality Assurance
In place, is a quality assurance program that utilizes computer assisted tracking analysis. From the incoming raw material to the final product, this internal tracking system ensures absolute adherence to strict quality standards. This flatly guarantees quality, consistency, traceability, and enables 100% reproducibility of product for long term production demands.
